The Master-P510APEX is designed specifically for large-size panel-level packaging. It features high uniformity across the entire panel surface and precise flattening control, which is essential for maintaining low defect rates during the polishing process.
The equipment utilizes intelligent endpoint detection and automated control to enable flexible switching between various process modes. This allows advanced packaging lines to achieve high consistency and high yield rates during large-scale mass production.
The transition to panel-level packaging is driven by the AI, high-performance computing, and 5G communication sectors. This shift from wafer-level to panel-level packaging is necessary to meet increasing demands for integration, power consumption, and cost reduction.