On November 12, Tsinghua Unigroup and BAIC Group officially launched a joint innovation center in Beijing. The partnership aims to integrate automotive chip research with vehicle manufacturing applications, focusing on key technologies for modern intelligent vehicles.
The collaboration covers several critical areas, including SoC chips, intelligent cockpit systems, smart chassis domain controllers, and cockpit-driving integration. These efforts are intended to accelerate the development and deployment of advanced automotive electronic solutions.
As part of the agreement, Unigroup's subsidiary, Unigroup Guoxin Microelectronics, signed a strategic deal with the BAIC Research Institute. The companies plan to co-develop advanced SoC chips that combine cockpit and driving control functions.
Both organizations stated that the initiative seeks to promote the large-scale adoption of domestic automotive chips. By leveraging their respective industrial strengths, the partners aim to foster the high-quality development of the intelligent vehicle sector.
