European CPU startup SiPearl has entered into a strategic partnership and investment agreement with the Taiwanese chip design firm Egis Technology. The collaboration focuses on the development of SiPearl's next-generation processor, Rhea2.
The Rhea2 chip will utilize the same architecture as the Mobius100 server CPU, which is being developed in conjunction with Alcor Micro, a subsidiary of Egis. The Mobius100 design is built on the Arm Neoverse V3 platform.
The processor architecture leverages TSMC's N3P process node and features a dual-chiplet design with 128 active cores and 12 redundant cores. It supports DDR5 MRDIMM memory at 12800MT/s and includes PCIe Gen6 and CXL Gen3 connectivity.
To facilitate high-speed communication, the chip incorporates 8 UCIe 2.0-S interconnect interfaces provided by InPsytech, another Egis subsidiary. The Mobius100 is scheduled to reach the engineering sample stage in 2027, with mass production slated for the second half of 2028. SiPearl plans to release the Rhea2 shortly thereafter.
