Samsung Electronics is diversifying its supply chain for HBM memory base dies by outsourcing production to TSMC. This move aims to address the growing demand for customized HBM solutions that the company's internal manufacturing model cannot fully satisfy alone.
Some customers have already begun integrating HBM stacks featuring a combination of Samsung DRAM dies and TSMC base dies into their chip designs. While Samsung's internal System LSI division will continue to design and manufacture base dies for clients opting for the company's proprietary integrated approach, the memory division will now take on design responsibilities for projects utilizing TSMC base dies.
To support this shift toward customization, Samsung has recruited additional chip design talent from its internal System LSI unit. The company expects this collaborative strategy with external foundries to broaden its sales reach as HBM technology evolves to offload more processing functions and circuits from main processors onto the base die.
