Starting in 2027, companies utilizing state funding for microelectronics production must ensure that at least 30% of their equipment is of Russian origin. This quota is set to rise to 40% in 2028 and reach 50% by 2030, according to the Ministry of Industry and Trade. The policy applies to specialized machinery for manufacturing semiconductor wafers, integrated circuits, displays, and printed circuit boards.
The domestic production of electronic equipment is projected to reach 5.58 ₽ billion in 2026, up from 5.32 ₽ billion in 2025. To support this transition, the government provides R&D subsidies and low-interest loans via the Industrial Development Fund. Enterprises can also receive compensation for up to 30% of the cost of a Russian-made machine, capped at 50 ₽ million per unit.
The push for modernization is driven by significant equipment wear, with the Ministry reporting an average depreciation of 50%. At the Element group, over 60% of crystal production units date back to before 2000. Experts warn that rapid restrictions on foreign imports could increase project costs and timelines, particularly in complex crystal manufacturing processes.
Current domestic capacity stands at over 100,000 semiconductor wafers annually, calculated in 200mm equivalents. Strategy Partners estimates that ongoing and planned projects could quadruple this output to approximately 400,000 wafers by 2030. The ministry has yet to clarify if the new equipment quotas will be calculated based on the number of units or their total monetary value.
