Representatives from leading Russian design centers and microelectronics manufacturers have agreed to form an interdepartmental working group to standardize chiplet technologies. The initiative aims to achieve technological sovereignty by enabling the creation of high-performance systems using mature 28nm process nodes, reducing reliance on advanced lithography.
Participants showcased existing developments, including 25 Gbit/s transceivers from NIISI, neuromorphic cores from Module and Hitech, and various interconnect solutions from RFYATs-VNIITF and Rosatom Quantum Technologies. Tramplin Electronics presented multi-die server processors, while RSK detailed power and cooling capabilities for complex chiplet assemblies.
The industry experts emphasized that without domestic standards for interfaces, packaging, and testing, market fragmentation could hinder development within two to three years. They proposed a hybrid funding model where the state supports anchor projects and core technology development, while private companies handle commercialization.
The group plans to utilize the TK-167 infrastructure for institutionalization, with initial organizational steps expected by the end of 2026. Future plans involve establishing a formal technical committee under the supervision of the Nizhny Novgorod region to oversee the creation of a trusted chiplet platform.
