The NearLink high-bandwidth SLB 2.0 standard is scheduled for commercial release by the end of 2026. Beijing CAS-IC Technology is currently focusing on the development of NearLink 2.0 chips, targeting applications in embodied intelligence. The company expects the first high-bandwidth SLB 2.0 chips to hit the market in December 2026, which will facilitate the adoption of NearLink access points and routers.
Huawei has been actively integrating NearLink technology into its networking hardware. At the AWE 2024 exhibition, the company showcased a Wi-Fi 7 NearLink router based on the BE3 Pro model. This device features local AI cores and interference-resistant algorithms, achieving a theoretical peak speed of 3600 Mbps. It is specifically designed to support smart home ecosystems.
In April 2024, Huawei introduced the X1 router series, which supports NearLink, Wi-Fi, and Bluetooth protocols. Subsequent releases, such as the Lingxiao Q7 powerline router, introduced the NearLink gaming link feature. This technology enables direct connections for Huawei smartphones and tablets, with the company reporting a 50 percent reduction in gaming latency.
