The International NearLink Alliance is hosting the CEIC 2026 summit in Shenzhen from October 22 to 24. The event will showcase the debut of NearLink 3.0, which introduces a new passive SLZ air interface mode. This technology is positioned to compete with existing RFID solutions.
The summit will also feature demonstrations of NearLink-enabled electronic paper, HarmonyOS products, wireless live-streaming cameras, and home theater systems. Additionally, the agenda includes a presentation on the NearLink SLE 3.0 technical standard and new vehicle key solutions for two-wheeled transport.
NearLink currently supports three existing air interface modes. The SLB mode handles broadband tasks like automotive noise cancellation and screen casting with sub-30cm ranging accuracy. The SLE mode focuses on low-power applications such as audio transmission and battery management.
The third mode, SLP, utilizes UWB signals for high-precision positioning. It achieves ranging accuracy within 10cm and angular accuracy within 5 degrees, currently powering remote control applications. These technologies form the foundation of the NearLink ecosystem.
