Huawei and Qualcomm announced a long-term, broad patent cross-licensing agreement on October 5. The deal covers patent portfolios in 5G, computing, artificial intelligence, and networking. Additionally, Qualcomm will acquire certain US patents from Huawei in these fields.
Following the announcement, Bloomberg reported that Qualcomm had obtained a license for technology supporting Huawei's logic folding chip manufacturing. This claim sparked significant industry discussion regarding the scope of the agreement.
Qualcomm responded on October 6, stating that the specific terms of the deal are confidential. The company explicitly denied that the agreement includes licensing for logic folding chip technology and clarified that reports labeling Qualcomm as a net payer are inaccurate.
Conversely, Shenzhen News reported on October 6 that Huawei confirmed the licensing deal includes patents for Near-Packaged Optics (NPO) interconnect technology and logic folding chip technology. Official press releases from both companies do not mention these specific terms.
