HMD is preparing an updated version of its modular Fusion smartphone for the European market. According to leaks, the device will feature a Qualcomm Snapdragon 7s Gen 2 processor, replacing the previous Snapdragon 4 Gen 2 platform.
The updated model will offer 8 GB or 12 GB of RAM along with 256 GB of internal storage. The display is upgraded to a 6.56-inch IPS panel with Full HD+ resolution and a 120 Hz refresh rate, improving upon the earlier HD+ 90 Hz screen.
The camera system includes a 108 MP main sensor with optical image stabilization, a 2 MP secondary module, and a 50 MP front-facing camera. The battery capacity remains at 5000 mAh, supporting 33 W wired charging.
The original HMD Fusion, launched in September 2024, features Smart Pin connectors for modular accessories. HMD also provides an open-source toolkit for users to design and 3D print custom compatible cases for the device.
