GlobalFoundries has entered into a five-year agreement with TSMC to manufacture silicon bridges in the United States. These components are essential for connecting computing units and memory within advanced AI chips, facilitating high-speed data exchange.
The production will take place at the GlobalFoundries facility in New York, which is currently undergoing expansion to accommodate the new manufacturing requirements. This site will serve as the first domestic supplier of such silicon bridges for advanced chip packaging in the US.
Mass production of the silicon bridges is scheduled to begin in the first half of 2028. Following the announcement of the partnership, GlobalFoundries shares experienced a 4% increase in value during pre-market trading.
This collaboration addresses the industry-wide challenge of packaging capacity constraints. As monolithic chip sizes reach physical limits, multi-chip packaging with complex spatial layouts has become a critical method for increasing performance.
