Chinese DRAM manufacturer CXMT plans to launch mass production of HBM3E memory, which is essential for AI accelerators. The company has already provided samples to local developers and expects to begin small-scale production within the next two months.
The company faces significant manufacturing challenges, with the yield rate of usable chips currently ranging between 20% and 30%. In comparison, industry leader SK hynix maintains a yield rate of approximately 70%.
Due to US export restrictions on advanced AI accelerators and HBM, Chinese companies like Huawei, Cambricon, MetaX, and Iluvatar CoreX have raised their prices by 20% to 50%. High production costs at CXMT are expected to result in higher prices for their HBM3E compared to foreign competitors.
CXMT currently holds a 10% share of the global DRAM market. However, the company remains at least one generation behind leaders like Samsung, which has already begun supplying HBM4E samples. US sanctions further limit the company's access to advanced manufacturing equipment.
