Bank of America, Citigroup, Morgan Stanley, and Blackstone are organizing a $60 billion debt financing package to fund AI chip acquisitions for Anthropic. The structure involves a special-purpose vehicle that purchases the hardware and leases it to the company.
The financing is divided into two tiers: a $42 billion Class A senior-secured tranche and a $18 billion Class B junior tranche. Blackstone is leading the junior portion and has committed $9 billion of its own capital to the deal.
The funds are designated for Broadcom custom silicon. Anthropic’s IPO prospectus, filed around October 1, 2026, reveals a total lease commitment of $125.2 billion for tensor processing units. Broadcom may also provide up to $42 billion in lending, which could be converted into equity.
This initiative follows a $35 billion financing tranche closed in June 2026 through the Broadcom-Apollo-Blackstone partnership. The collaboration aims to expand Anthropic’s computing capacity to over 20 gigawatts by 2028, with Anthropic potentially becoming Broadcom’s largest custom-chip client by fiscal year 2027.
