The UCIe Consortium officially released version 4.0 of its chiplet interconnect specification on November 12. This update shifts the architecture from traditional chip-level interface design toward comprehensive system-level integration, allowing for more efficient assembly of multiple chips within a single package.
A key addition is the UCIe.mem protocol, which standardizes on-chip memory links. This protocol simplifies the integration between SoCs and memory logic dies, achieving data efficiency of up to 93.75 percent and a bandwidth density of approximately 2.5 TB/s/mm.
The new specification introduces power optimization profiles that deliver energy efficiency gains of 30 to 80 percent at 64GT/s. Additionally, the updated design features enhanced bump layouts for standard packaging, which significantly improves overall area efficiency.
The 4.0 release also prioritizes security and reliability. It includes new features such as trusted chip state reporting and bidirectional integrity protection for management channels. Furthermore, the standard now provides extended support for system-level reliability in automotive applications.
