Samsung Foundry is reportedly set to produce custom AI accelerators for Anthropic using its SF2 2 nm manufacturing process. The initial production run for these chips is expected to reach approximately 200 000 units.
Broadcom is managing the design and implementation of the ASIC. The target performance for the chip is 4 000 TOPS of INT8 compute, with a thermal design power of 1 300 W. The hardware will feature either 192 GB or 288 GB of HBM3E memory.
The manufacturing process utilizes Low-NA EUV lithography at facilities in South Korea, with additional capacity planned for Taylor, Texas. Samsung intends to use its I-Cube 2.5D packaging technology to integrate the 2 nm dies with HBM memory modules.
While the current order volume is modest compared to typical ASIC projects, the collaboration marks a strategic move for Samsung. The company aims to strengthen its contract manufacturing position and compete more effectively with TSMC.
