Samsung Foundry is allocating approximately half of its 4nm (SF4) production capacity to the manufacture of HBM4 base dies. This strategic shift comes as customers for HBM4 and the upcoming HBM4E standards require the integration of custom logic circuits, such as memory controllers and PHY, directly into the base die.
The integration of custom logic into the base die allows customers to reduce the area occupied by these components on the main computing chiplet. Samsung currently produces SF4 chips at the P2 and P3 plants in the Pyeongtaek campus, specifically on the S5 and S6 production lines.
The company is seeing a growing demand for HBM4 base dies, particularly from ASIC customers seeking to maximize chip performance. This trend is coinciding with a Samsung's increasing market share in the HBM sector. By the second quarter of 2026, Samsung's HBM market share by revenue is expected to reach 38%, up from 15% a year earlier.
In contrast, SK Hynix's market share is projected to decrease from 64% in the second quarter of 2025 to 50% by the second quarter of 2026. This shift is attributed to customers diversifying their suppliers and increasing their procurement of HBM products from Samsung.
