The newly formed United Microelectronics Company (UMC) plans to construct three semiconductor facilities in Russia. The core project involves a 300mm wafer factory capable of producing 14nm chips, with completion targeted for 2036. Pre-project work for this facility is scheduled to begin in 2027.
Two additional facilities are planned to support the production chain. A module manufacturing plant is expected to be completed by late 2028, while an OSAT (Outsourced Semiconductor Assembly and Test) facility for substrate and module production is slated for completion in 2031.
Total investment in the UMC project is projected to reach 1.101 ₽ trillion by 2036. Funding is allocated as follows: 1.031 ₽ trillion for production, 50 ₽ billion for design, and 20 ₽ billion for a breakthrough technology fund. Annual investments are scheduled through 2036, with contributions from both the Russian government and Sberbank.
The UMC structure is being established under Presidential Decree No. 297 to consolidate key domestic microelectronics assets. The managing entity is LLC Integral Circuits. The project aims to create a vertically integrated platform covering the entire cycle from crystal manufacturing to final assembly and testing for both military and civilian applications.
