Harrison Kim, General Manager of OpenAI Korea, announced at a press conference in Seoul that the company is collaborating with Samsung Electronics on the research and joint production of next-generation chips.
OpenAI currently operates an AI ASIC program using Broadcom's design services and TSMC's wafer processing and advanced packaging. The company's first inference AI accelerator, Jalapeño, was co-designed with Broadcom and manufactured by TSMC in under 18 months.
While the first generation of Jalapeño is already in mass production at TSMC, the company is now focusing on next-generation processors. The successor to Jalapeño is currently under development and approaching tapeout.
The potential shift toward Samsung is supported by a strategic partnership between Samsung Electronics and Broadcom, valued at over $200 billion through 2030, focusing on AI infrastructure technologies.
OpenAI has an agreement with Broadcom to procure 10GW of custom AI accelerators. Utilizing both Samsung and TSMC as foundries could help the company secure the necessary aggregate capacity to meet these massive volume requirements.