LG Electronics is expanding its production capacity for AI data center cooling systems. The company plans to build a new facility in Windsor, Virginia, and upgrade two existing plants located in Pyeongtaek and Changwon, South Korea.
The total investment for these projects is ₩150 billion, which is approximately $111.7 million. The new US facility will cover a site of about 170,000 square meters, with building structures occupying roughly 30,000 square meters.
The new plant will focus on manufacturing air-cooled chillers designed to dissipate heat from high-performance computing equipment. Operations at the Virginia site are scheduled to commence in the second half of 2027.
This expansion supports LG's 'chip-to-chiller' strategy, which aims to provide comprehensive thermal management solutions. In addition to chillers, the company is developing Coolant Distribution Units to handle heat across various server components.
