Huawei showcased the architecture of its new Kirin 9050 Pro processor during a media event held in Shanghai on October 13, 2026. Xu Songyu, head of the wireless terminal chip product management department, presented the technical details of the series.
The Kirin 9050 Pro features a new generation of Lingxi CPU, Maliang GPU, and Da Vinci architecture NPU. The chip also integrates a new Kirin AI ISP, a Lingxi micro-core, an FFTS function flow task scheduler, and a dedicated security processor.
The company confirmed that the Kirin 9050 series has reached mass production with the support of the domestic semiconductor industry. The chip is described as the first logic-folding Tao chip, marking a significant milestone in Huawei's hardware development.
Despite the production success, Huawei identified several ongoing challenges for the Tao architecture. These include optimizing cross-layer interconnect overhead, managing energy consumption, refining toolchains, and establishing new benchmark testing methods.
Xu Songyu emphasized the importance of collaboration between the semiconductor industry and academic institutions. He noted that future progress depends on open cooperation, as no single company can address all technical hurdles alone.
