Huawei unveiled the world's first 3D data center at the 2026 AIDC Industry Development Conference in Wuhu, Anhui. The company also released a dedicated book titled '3D Data Center' and provided access to a library of conceptual design diagrams for these facilities.
The new architecture addresses challenges in AI computing, such as safety and compatibility across different generations of AI chips. It adopts a four-layer design: cooling, IT equipment, power supply, and backup power, inspired by the separation of power and production layers in semiconductor manufacturing.
According to Huawei, cabinet power density has surged from a few kilowatts to 100–200 kilowatts, necessitating this structural shift. The 3D design allows for partitioned cooling, vertical power distribution, and shorter routing, which reportedly cuts mechanical and electrical delivery time in half.
Huawei is currently scaling the deployment of 3D data centers across its core cloud hubs in Gui'an, Guizhou; Horinger, Inner Mongolia; and Wuhu, Anhui. The released design documentation covers various engineering disciplines, including architecture, structural design, and power systems.
