Honor has officially scheduled its Magic event and the launch of the Magic9 series for September 28 in Beijing. The company confirmed the design of the Magic9 Pro Max, which features a horizontal camera module containing two small circles and one large circle.
The Magic9 Pro Max camera system is developed in partnership with Leica. It includes a 200MP periscope telephoto lens with a 1/1.4-inch sensor and optical image stabilization. Reports suggest the series will feature a dual 200MP imaging setup, with the main sensor measuring 1/1.28 inches.
The new smartphone lineup is expected to be among the first to utilize Qualcomm's 2nm flagship processor. The series will include multiple models, with a special 'Super' version rumored to incorporate an active cooling fan for improved thermal management.
