Honor has officially announced the upcoming Magic9 series, which will feature the third-generation C3 RF enhancement chip. The devices utilize a seven-core AI scheduling architecture capable of intelligent switching between 356 frequency band combinations, optimized for 38 distinct usage scenarios.
The new flagship lineup introduces dual 3D biometric authentication, combining 3D ultrasonic fingerprint scanning with 3D face recognition. The hardware design includes IP68, IP69, and IP69K ratings for durability, along with dedicated AI and camera buttons.
Leaked specifications indicate two variants. The first model features the Snapdragon 8E5 processor, an 8000mAh battery with 80W wired and 50W wireless charging, and a camera system including a 200Mp main sensor and a 200Mp periscope telephoto lens.
The second variant is equipped with the Snapdragon 8EE6 processor, an 8800mAh battery, 100W wired and 80W wireless charging. It includes a 6.81-inch 1.5K display with a 120Hz refresh rate and ultra-narrow 1mm bezels, alongside a 200Mp main camera with a 1/1.28-inch sensor.
