GlobalFoundries has introduced its 7nm-class FDX Fusion chip platform, designed for physical AI applications such as real-time sensing and edge connectivity. The platform supports operations at temperatures up to 150 degrees Celsius, catering to automotive and industrial requirements.
The company plans to launch production at its Dresden facility in 2028. This move is supported by the SPRINT project, an infrastructure investment of approximately €1.1 billion. The goal is to increase production capacity to over 1 million 300mm wafers annually by the end of 2028.
GlobalFoundries expects the physical AI market to exceed $18 billion by 2030. The company has been shipping FDX chips since 2019, with over 3 billion units delivered to date. The architecture utilizes a planar design on an insulating layer to reduce power leakage.
The roadmap includes the UX platform family, featuring 40UX and 22UX variants. Production design kits for these chips are scheduled to be available to customers in September 2026, allowing for a two-year development cycle before full-scale manufacturing begins.
