GlobalFoundries has announced FDX Fusion, a new fabrication technology targeting 7nm-class digital performance. The process promises more than double the transistor density of the company's existing 22FDX platform, which was introduced around 2015.
The technology integrates digital logic with RF, analog, mixed-signal circuitry, embedded nonvolatile memory, and in-memory computing. It supports RF transistors with fT/fmax up to 0.5 THz and will offer processor IP based on MIPS, ARC, and RISC-V architectures.
Production is scheduled to begin at the company's facility in Dresden, Germany, in 2028. GlobalFoundries plans to provide initial demo silicon for customer evaluation in early 2027, with the first process design kit expected by mid-2027.
Several companies, including BMW, Bosch, Infineon, NXP, Siemens, and Tesla, have expressed interest in the technology. Infineon has specifically confirmed its collaboration on future 7nm-class technologies for radar and wireless communications.
