GlobalFoundries and TSMC have entered into a five-year manufacturing agreement focused on silicon interposers. The partnership aims to reach volume production in the first half of 2028.
The collaboration utilizes the 65PKG platform from GlobalFoundries, which is rated at TRL9. This platform features through-silicon vias measuring 10µm by 100µm and multi-layer copper routing for heterogeneous integration.
Production will take place at the GlobalFoundries facility located in Malta, New York. The technology is intended to support high-performance computing and AI workloads by enabling dense connections between processors and memory.
Financial terms, customer identities, and specific capacity commitments remain undisclosed. TSMC continues to utilize its CoWoS technology, which supports interposers up to 2,700 mm².
GlobalFoundries is leveraging support from the CHIPS Act, which included $375 million in funding for quantum technology finalized in 2026. The company also plans to initiate a GaN technology licensing agreement in 2025.
