Compal Electronics is presenting new infrastructure solutions for AI factories at the OCP Global Summit 2026, held from October 12 to 15 in San Jose. The company is showcasing its technology at booth E65.
The core of the offering is an 800VDC power architecture combined with megawatt-class infrastructure. These systems are designed to manage increasing power density demands in large-scale AI deployments.
Compal is bundling power delivery, cooling, high-density compute, and rack-scale engineering into integrated systems. This approach aims to support scaling from individual platforms to megawatt-level operations.
The development follows Nvidia's release of open designs for its Vera Rubin rack-scale architecture. Compal is tailoring its hardware to align with these specifications to assist in building large AI systems.
