Engineers at GRAN Group identify frequent documentation errors in printed circuit board (PCB) projects that delay production. Common issues include incomplete order forms, incorrect board type specifications, and unrealistic tolerances that deviate from IPC standards.
Designers often confuse board types, such as mislabeling flexible boards as rigid-flex, or misapplying HDI technology for small holes that could be drilled mechanically. Additionally, confusion between base and finished copper thickness, as well as inaccurate board thickness tolerances, frequently requires manual clarification.
Manufacturing precision is limited by standard processes: milling tolerances are typically around 0.1 mm, while V-cut scoring requires 0.15–0.20 mm. Engineers recommend avoiding overly strict tolerances unless necessary for specific applications like press-fit connectors.
Proper documentation should explicitly define solder mask openings, differentiate between plated and non-plated holes, and avoid redundant information. Using IPC standards as a baseline instead of GOST helps streamline communication with international production facilities.
