Cisco Systems unveiled new hardware and software at the Open Compute Project Global Summit to address networking bottlenecks in AI data centers. The company is focusing on a programmable architecture designed to connect distributed AI clusters into a unified compute fabric.
The updated Silicon One chip family includes the 102.4-terabit G300, which is currently shipping in volume. Additionally, Cisco introduced the 51.2-terabit G302 switch, featuring a 200-gigabit serializer/deserializer interface and support for liquid cooling, with shipments expected by the end of the year.
In collaboration with Nvidia, Cisco developed the Ultra-Dense Small Form Factor Repluggable optical module. This transceiver supports 400-gigabit-per-second-per-lane signals and provides up to 12.8 terabits per second of capacity, offering four times the bandwidth density of existing 200G optics.
Cisco also introduced the 8001 out-of-band management system, powered by Silicon One A100 chips, to replace legacy management tools. Furthermore, the company announced updates to its SONiC network operating system, including a Live Protect security feature scheduled for release next year.
