The development of a system-on-module (SOM) based on the RK3568 processor requires careful consideration of the SMARC 2.1 standard. While the standard defines physical dimensions and a 314-pin edge connector, it allows for flexible pin assignments, which can lead to compatibility issues between modules and carrier boards.
Engineers must align the module's pinout with the specific carrier board being used. The SMARC 2.1 specification permits multiple interface options on the same pins, such as LVDS, eDP, or MIPI_DSI. Failure to coordinate these configurations can result in restricted functionality or complete system failure.
The design process involves creating a structural diagram, managing voltage levels for GPIOs, and ensuring proper signal integrity for high-speed interfaces like Ethernet. Developers must also account for physical constraints, such as component height and PCB thickness, to ensure the module fits correctly into the carrier board connector.
The project took four months to complete, utilizing existing design libraries from a previous single-board computer project. A technical error occurred during the PCB manufacturing phase, resulting in a board thickness of 1.6 mm instead of the intended 1.2 mm, though the module remained functional.
