Broadcom is organizing debt packages to assist major AI labs in purchasing its custom chips and related infrastructure. The company aims to secure long-term orders while shifting credit risks to external lenders and special-purpose vehicles.
A financing package for Anthropic totals approximately $60 billion, with syndication beginning in early October 2026. This deal includes a $42 billion senior secured tranche backed by Broadcom and a $18 billion junior tranche led by Blackstone.
Broadcom also holds up to $42 billion in convertible notes for Anthropic, as disclosed in IPO filings from October 2026. Additionally, the company is in preliminary talks to provide a potential $30 billion to $50 billion package to OpenAI for its Nexus chip program.
These efforts align with the AI XPV platform partnership launched in June 2026 with Apollo Global Management and Blackstone. The initiative targets the financing of over 20 gigawatts of AI infrastructure by 2028, contributing to an estimated global demand of $1.5 trillion for data-center infrastructure.
