AMD is developing the Verano processor, a specialized CPU designed to serve as a host for AI accelerators in server environments. The chip features up to 72 Zen 6 cores with clock speeds reaching 5 GHz and utilizes a 24-channel LPDDR5X memory subsystem with replaceable SOCAMM2 modules.
Unlike general-purpose EPYC processors that use SP7 or SP8 sockets, Verano will reportedly utilize a dedicated SB1 socket. This design choice suggests that AMD may limit the number of available CPU configurations to maintain consistent performance ratios between host cores, memory bandwidth, and AI accelerators.
Cooling requirements for the new platform are becoming clearer through third-party hardware listings. Dynatron has introduced the SB1-4U-Active cooler, which measures 128.05 by 106.6 by 130.7 mm and features a vapor chamber, heat pipes, and a fan capable of 6,000 RPM.
The specifications for the Dynatron cooler are similar to those of the J26 model used for SP7 processors. While the exact thermal design power of the Verano chip remains undisclosed, the use of a large 4U active cooling solution indicates that the processor will have high power consumption.
