AMD is developing the Ryzen Z3 series, a custom processor platform for handheld gaming devices. The chip is expected to feature a Zen 6 CPU architecture and RDNA 4m GPU compute units. Preliminary reports suggest a configuration of 6 CPU cores and 12 RDNA 4m compute units, marking a shift in resource allocation compared to the Ryzen Z2 Extreme.
The RDNA 4m architecture is described as an evolution of RDNA 3.5, incorporating matrix calculation hardware to support advanced image reconstruction technologies like FSR 4. This design aims to prioritize graphical performance within the strict 15W to 25W power envelopes typical of handheld consoles, rather than focusing on raw CPU core counts.
The Ryzen Z3 will utilize the FF6 package, measuring 25x25mm. This footprint is smaller than the FP8 package used in Strix Point, potentially allowing manufacturers to create more compact handheld devices with more space for batteries or cooling systems. The platform is designed specifically for handhelds rather than being a repurposed laptop chip.
Official specifications remain unconfirmed as the information originates from non-official sources. The final CPU core configuration, GPU unit counts, and power management strategies for the standard and Extreme versions may change before the official product launch. AMD has not yet released any formal details regarding the Z3 series.
