Recent leaks of AMD drivers have revealed a new chip codenamed Gainsborough, which is manufactured using the TSMC N3P process. Reports indicate that AMD has already begun shipping test equipment for this semi-custom silicon to potential customers for validation.
The Gainsborough chip features an FF6 package measuring 25mm by 25mm. This matches the dimensions of the upcoming Ryzen Z3 and Z3 Extreme handheld chips. Leaked documentation suggests the Z3 series is designed for a 15-watt power envelope.
While speculation links Gainsborough to a potential Steam Deck 2, industry analysts note that semi-custom chips are not always exclusive to a single device. Furthermore, the 25mm by 25mm size is larger than the original 19mm by 19mm Aerith chip used in the Steam Deck.
Valve has stated that a successor to the Steam Deck requires a generational leap in performance and efficiency. As of last month, the company was still determining the timeline and specifications for its next handheld hardware.
