The Xiaomi 18 Fold features a 5.38-inch external display and a 7.58-inch internal screen, both with a 2:1 aspect ratio. The device weighs 219 grams, measuring 5.02 mm thick when unfolded and 10.68 mm when folded. It is built with a Dragon Bone Hinge, 7-series aluminum alloy frame, and Dragon Crystal Glass 3.0, making it resistant to drops from up to 1.2 meters.
The smartphone is powered by the Xiaomi Xring O3 chip, which is the first AI flagship processor to exceed five million points in AnTuTu. Compared to the previous generation, multi-core performance has increased by 60%, while GPU performance has risen by 85%. Power consumption has decreased by 25% under medium and low loads and by 64% for the GPU.
The Xring O3's NPU provides 200 TOPS of tensor performance and 3.12 Tflops of vector performance. The device is the first to use mass-produced LPDDR6 RAM from Changxin Memory (CXMT). It is equipped with a 6,000 mAh high-silicon battery with an energy density of 920 Wh/l, supporting 67W wired and 50W wireless charging.
Developed in collaboration with Leica, the camera system includes a 200 MP main sensor, a 50 MP periscope telephoto lens with 3.5x optical zoom, and a 50 MP ultra-wide lens. The device is available in red, golden-white, and black colors.
A limited Ceramic Special Edition featuring a silicon nitride back panel is available with 16 GB RAM and 1 TB storage, limited to 1,500 units. Prices for the standard models start at ¥10,999 (approx. $1,639) for the 12/256 GB version, reaching ¥14,999 (approx. $2,235) for the 16/1 TB model. The Ceramic edition costs ¥15,999 (approx. $2,384).
Pre-orders in China have already begun, with open sales starting on September 10 at 10:00 local time.
