TSMC is actively expanding its manufacturing capacity to address demand that currently exceeds supply. According to reports from UDN, the company has set a target to reach a production volume of 120 000 wafers per month for its 2 nm N2 node by the end of 2026.
This new production goal marks a 20 percent increase compared to the initial target of 100 000 wafers per month, which was announced in early August. The adjustment reflects strong interest from customers in the latest silicon technology provided by the manufacturer.
The company noted that the N2 node has already secured four times the number of tape-outs compared to the 3 nm N3 node during its early stages. This high level of activity indicates that demand for the new process node remains robust as the company scales its operations.
Financial data from the end of the second quarter of 2026 shows that the N2 node contributed 3 percent to the company's total revenue. In comparison, the 3 nm node accounted for 30 percent, while the 5 nm node led with 33 percent of total revenue.
