Sony has introduced a revised version of the PlayStation 5 Slim console, featuring internal design updates aimed at improving thermal performance and manufacturing efficiency. The changes were identified by a repair technician who examined a unit from the Marvel's Wolverine Limited Edition Bundle.
The new console model features a motherboard labeled EDM-051. A key modification involves the application of liquid metal, which serves as the thermal interface material between the APU and the heatsink. Sony has redesigned the barrier surrounding the chip to better contain the compound.
This updated containment system is designed to prevent the liquid metal from spreading to surrounding components, thereby reducing the risk of electrical shorts. Additionally, the heatsink has been reconstructed using different materials and a new design, mirroring an approach previously implemented in the PlayStation 5 Pro.
