Samsung is preparing to launch its next-generation flagship mobile processor, Exynos 2700, codenamed Ulysses. The chip is expected to enter mass production in the second half of 2026. Samsung aims to integrate this processor into the Galaxy S27 series, potentially including the Ultra model in specific markets, to reduce reliance on Qualcomm platforms.
The Exynos 2700 will be manufactured using Samsung's second-generation 2nm GAA process, known as SF2P. Compared to the first-generation SF2, this technology targets a 15% performance increase and a 26% reduction in power consumption. The chip features a 1+3+6 ten-core architecture utilizing ARM's new C2 series cores, with a peak frequency reaching 4.2GHz.
Technical upgrades include support for LPDDR6 memory and UFS 5.0 storage, alongside a new FOWLP-SbS packaging design. This packaging introduces a unified heat conduction structure to improve thermal management under high loads. The GPU remains based on AMD Radeon architecture, building upon the Xclipse series with enhanced ray tracing capabilities.
While internal tests suggest the Exynos 2700 could outperform the Qualcomm Snapdragon 8 Elite Gen 6 in CPU, GPU, and NPU benchmarks, these results remain unverified. The final integration of the chip into the Galaxy S27 lineup depends on the manufacturing yields of the 2nm process, which remains a critical factor for Samsung's semiconductor division.
