Red Magic has detailed the cooling system for the Red Magic 12 Pro+ smartphone ahead of its October 15 launch. The new ICE Magic architecture features a dual-circuit liquid cooling system using a server-grade fluorinated fluid, covering the processor, battery, and air ducts.
The system integrates a new dual-chip micropump with a power consumption of 20 mW and an output pressure of 130 kPa, an improvement over the 80 mW and 100 kPa specs of the previous model. The air cooling component includes the Wind Chaser 5.0 fan, which reaches speeds of 25,500 rpm.
The device incorporates ten heat dissipation layers, including a 4D Ice-Step VC vapor chamber, graphene, and liquid metal 4.0. The design also features IPX8 water resistance, a labyrinth dust protection system, and a through-channel for hot air exhaust.
The Red Magic 12 Pro+ features a thinner, lighter, and narrower body compared to its predecessor. The screen bezel has been reduced from 1.25 mm to 0.96 mm. Pre-orders for the new smartphone are currently open.
