The upcoming Pico Space Pro mixed reality headset has appeared in Japanese regulatory filings under model number B3110. The documentation, which matches previous FCC filings, includes photos of the device's exterior and internal components, confirming a design that features an external computing module.
Internal images reveal a front-facing camera and sensor array, an optical module, and a central cooling fan. The headset is expected to feature a micro-OLED display with a pixel density of 4000 PPI. It utilizes a dual-chip architecture, combining a proprietary co-processor for computer vision with a new main processor.
The device's main processor is reported to offer double the CPU and GPU performance of the Qualcomm Snapdragon XR2 Gen 2. While the headset was originally scheduled for a September 2 launch, the release is now targeted for the fourth quarter of this year.
Although some reports suggest a 2026 launch, the current release window remains the fourth quarter of 2024. Further details may become public following the expiration of the FCC confidentiality period on February 28, 2027.
