GS Nanotech and NIIET have completed the packaging of a pilot batch of the K1921VG10Ya microcontroller. This new version of the K1921VG1T chip features a BGA216 package measuring 13x13 mm, replacing the previous 28x28 mm LQFP-208 format.
The transition to the BGA package reduces the footprint on printed circuit boards by up to five times. GS Nanotech handled the substrate development and the entire packaging process, including die attachment, wire bonding, molding, and ball grid array mounting.
The K1921VG1T microcontroller is based on dual RISC-V cores with a clock frequency of up to 204 MHz. It includes 4 MB of Flash memory, 1 MB of SRAM, a Gigabit Ethernet controller, and a hardware crypto-module supporting AES, Kuznyechik, and Magma standards.
The successful pilot run confirms the readiness of NIIET and GS Nanotech for mass production. Previously, GS Nanotech also transitioned the K5591XC1Ya FPGA from a ceramic package to a plastic BGA576 format to increase its availability for mass-market civil applications.
