Leaked images from the YouTube channel Moore’s Law Is Dead reveal the potential chiplet layout for Intel’s upcoming Nova Lake-HX and Nova Lake-H mobile processors. The HX model is expected to feature 28 cores, comprising 8 performance cores, 16 efficiency cores, and 4 low-power efficiency cores. The package size is estimated at 12 by 30 millimeters with an area of 360 square millimeters.
The Nova Lake-HX configuration reportedly utilizes six chiplets, including a 104-square-millimeter compute die, a 72-square-millimeter central hub die, and a 26-square-millimeter graphics die with 4 Xe cores. Two passive structural dies of 21 and 85 square millimeters are also included. The Nova Lake-H variant is expected to feature 16 cores and a smaller 276-square-millimeter package.
Reports suggest a multi-process manufacturing strategy for the chiplets. The compute dies may be produced using TSMC’s N2P process, while the hub and control dies could utilize Intel 18A-P, and the graphics die might leverage Intel 3-E. These specifications remain unconfirmed, as Intel has not officially released details regarding the architecture, manufacturing nodes, or release dates.
