IBM is expanding its partnership with Rapidus by establishing a new base in Chitose, Hokkaido. This location serves as the site for the first Rapidus 2nm wafer fabrication plant, which is central to Japan's national strategy to achieve mass production of advanced 2nm chips by 2027.
Rapidus is backed by a consortium of major Japanese corporations, including Toyota, Denso, Sony, SoftBank, NTT, Kioxia, NEC, and Mitsubishi UFJ Bank. The company aims to restore Japan's competitiveness in advanced logic semiconductors and bridge the gap with global leaders like TSMC, Samsung, and Intel.
Under the partnership, Rapidus has licensed IBM's 2nm manufacturing technology. IBM's presence in Chitose is intended to facilitate technology transfer, support workforce training, and assist with production preparations. The company has already begun installing equipment for its pilot production line.
The Japanese government is providing significant financial support to Rapidus, viewing the project as vital for economic competitiveness and supply chain security. Rapidus has adopted a high-risk strategy by targeting the 2nm node directly rather than scaling up from mature processes.
