Honor has officially announced that the upcoming Magic9 series will feature a hybrid architecture supporting two physical SIM cards and two eSIMs. This configuration allows users to manage four SIM cards simultaneously, with the capability to keep two numbers active at the same time.
The flagship Magic9 Pro Max model will be equipped with a proprietary Black Diamond screen featuring a 5,600-layer silicon nitride coating, which reduces screen reflectivity to 1.5%. The device is powered by the Snapdragon 8EE6 processor and includes a large 8,800 mAh battery with 100W wired and 80W wireless charging support.
The display is a 6.8-inch 1.5K LTPO panel with a 120Hz refresh rate. The camera system consists of a 200MP main sensor, a 50MP ultra-wide lens, and a 200MP periscope telephoto camera. The front camera is a 55MP square sensor. The device also features 3D facial recognition and ultrasonic fingerprint scanning.
Additional specifications for the Magic9 Pro Max include dedicated AI and camera buttons, dual 1216 speakers, and IP68, IP69, and IP69K ratings for dust and water resistance. The series is scheduled for an official release tomorrow.
