Honor has announced the upcoming Magic9 smartphone series, which will feature dual 3D biometric authentication. The new lineup includes both 3D ultrasonic fingerprint scanning and 3D facial recognition technology.
The official launch event is scheduled for September 28 in Beijing. According to leaked specifications, the series will offer two distinct hardware configurations based on the Snapdragon 8E5 and 8EE6 processors.
The base model will be equipped with an 8000mAh battery, supporting 80W wired and 50W wireless charging. Its camera setup includes a 55MP front sensor and a rear array featuring a 200MP main lens, a 50MP ultra-wide lens, and a 200MP periscope telephoto lens.
The premium version will feature an 8800mAh battery with 100W wired and 80W wireless charging. This model includes a 200MP main sensor with a 1/1.28-inch format, a 50MP ultra-wide lens, and a 200MP periscope telephoto lens, alongside dual 1216 speakers.
Both devices will feature a 6.81-inch 1.5K display with a 120Hz refresh rate and 1mm bezels. The phones are designed with dedicated AI and camera buttons and carry IP68, IP69, and IP69K ratings for dust and water resistance.
