GlobalFoundries and TSMC have entered into a five-year manufacturing agreement valued at $2 billion. Announced on October 8, 2026, the deal focuses on the production of silicon interposers for TSMC’s CoWoS advanced packaging ecosystem.
The manufacturing process will be based at the GlobalFoundries facility in Malta, New York. The company plans to expand its capacity at this site, which will serve as the first US-based source for these specific components used in high-performance AI accelerators.
The interposers produced under this partnership will feature embedded deep trench capacitors. This design is intended to support the high-speed communication between processors and memory required for modern multi-die AI hardware.
The agreement includes a framework for potential capacity increases to meet growing market demand. Volume production at the Malta facility is scheduled to begin in the first half of 2028.
Following the announcement, GlobalFoundries shares experienced a rise of up to 7%. The deal aligns with industry efforts to strengthen domestic semiconductor supply chains and address bottlenecks in advanced packaging.
