Frore Systems has introduced the LiquidJet Diamond, a new cooling solution that builds upon the company's existing 3D ultra-short loop multi-stage customizable cold plate technology. The updated design incorporates an integrated diamond wafer heat spreader specifically engineered to target and cover heat hotspots.
The company reports that the LiquidJet Diamond is capable of cooling extreme hotspots with a power density of 770 W/cm². Compared to the previous LiquidJet model, this integration allows for a 10-degree Celsius reduction in GPU hotspot temperatures and a 10 percent improvement in token energy efficiency.
