Chinese company CXMT has started mass production of LPDDR6 memory, which has already been integrated into the Xiaomi 18 Fold flagship smartphone. The memory chips have a capacity of 16 GB and offer a maximum data transfer rate of 12,800 Mbps, while the speed in smartphone interaction is 10,667 Mbps.
The LPDDR6 chips follow the JEDEC standard and use an FBGA package with 1,295 contacts. Compared to LPDDR5X, this new memory type increases bandwidth by 60% and reduces power consumption by 20%, which extends battery life. Flexible voltage management for individual blocks and intelligent resource planning further optimize energy efficiency.
The new packaging design reduces crystal thermal resistance by 40% compared to LPDDR5, improving heat dissipation under load. Beyond smartphones, LPDDR6 memory will be used in PCs, wearables, wearables, servers for edge computing, and robotics.
According to TrendForce, CXMT's share of the global DRAM market in monetary terms grew from 7.6% to 9.5% by the end of the second quarter, making it the fourth largest global memory chip manufacturer.
Competitors are also advancing: SK hynix has completed development of its 10nm-class LPDDR6 and will start deliveries this half-year. Samsung Electronics showcased LPDDR6 samples at CES 2026 in January, though mass production dates are not yet announced. Micron is currently shipping samples to customers but has not disclosed commercial delivery timelines.
