Cerebras Systems is bypassing industry-standard bottlenecks by avoiding high-bandwidth memory, CoWoS packaging, and 3nm manufacturing. Its WSE-3 and WSE-3T chips utilize TSMC’s 5nm process, integrating 44 GB of on-chip SRAM to handle memory tasks internally.
The WSE-3, announced in March 2024, features 900,000 AI cores and 4 trillion transistors. CEO Andrew Feldman claims this architecture significantly increases token-generation speeds for AI models compared to traditional GPU-based designs.
As of June 2026, the company reported a backlog of $25.4 billion, with over $20 billion attributed to a multi-year contract with OpenAI. Cerebras also manages over 600 MW of data-center capacity, with Q2 revenue nearly doubling year-over-year.
Following its May 2026 Nasdaq IPO, the company is expanding US manufacturing. Recent agreements include supplying CS-4 systems for 100 MW of capacity to Gimlet Labs and a long-term partnership with General Compute, with deployment scheduled for Q1 2027.
