BOE Technology Group is preparing to invest in a mass production line for semiconductor glass substrates. Chairman Chen Yanshun announced the initiative during the company's annual IPC2026 event held in Beijing on September 22.
The company has been researching glass substrate technology for three years and is currently collaborating with clients on product development. This technology is considered a potential alternative to traditional silicon materials in the semiconductor industry.
BOE aims to integrate optoelectronic technologies into new sectors, including perovskites and semiconductor substrates. This move aligns with the company's broader business strategy, which focuses on display technology as its core foundation.
The industry is increasingly focusing on advanced packaging, such as glass cores, due to the rising demand for artificial intelligence and larger semiconductor substrates. Display manufacturers are leveraging their expertise in glass processing to enter this market.
BOE continues to follow its 1+4+N+Ecosystem business structure. The core display business remains the primary focus, while the four secondary areas include IoT, sensors, MLED, and smart healthcare. The company also utilizes the N-curve theory to drive innovation and overcome growth bottlenecks.
